4XG7A14257 - Lenovo SR850/SR860 XEON PLATINUM 8260

Second-generation Xeon Scalable processors are limited to the amount of memory they can address, as follows: - Processors with an L suffix (eg 8260L): Up to 4.5 TB per processor - Processors with an M suffix (eg 8260M): Up to 2 TB per processor - All other processors: Up to 1 TB per processor The calculation of the total memory per processor includes both the system memory DIMMs and the Persistent Memory DCPMMs installed in the server. For example: - A configuration using 12x 64GB DIMMs per processor is a total of 768 GB, which means that neither an M nor an L processor is required - A configuration using 12x 128GB DIMMs per processor is a total of 1.5 TB, which means that an M processor is required - A configuration using 6x 32GB DIMMs + 6x 256GB DCPMMs is a total of 1.69 TB which means an M processor is required (an L processor may also be used) - A configuration using 6x 128GB DIMMs + 6x 512GB DCPMMs is a total of 3.75 TB which means an L processor is required The following table lists the features of the supported second-generation Intel Xeon processors.

 

Specification:

 

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	3.1 GHz
Cooler included	No
Thermal Design Power (TDP)	200 W
Processor cache	25 MB
Processor model	6254
Processor threads	36
Processor operating modes	64-bit
Processor boost frequency	4 GHz
Stepping	B1
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	18
Box	No
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1000 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	200 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	4S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	200 W
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
AVX-512 Fused Multiply-Add (FMA) units	2
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	200 W
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	4S
Embedded options available	No
Market segment	Server
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	82 °C