4XG7A14258 - Lenovo SR850/SR860 XEON GOLD 6254

Second-generation Xeon Scalable processors are limited to the amount of memory they can address, as follows: - Processors with an L suffix (eg 8260L): Up to 4.5 TB per processor - Processors with an M suffix (eg 8260M): Up to 2 TB per processor - All other processors: Up to 1 TB per processor The calculation of the total memory per processor includes both the system memory DIMMs and the Persistent Memory DCPMMs installed in the server. For example: - A configuration using 12x 64GB DIMMs per processor is a total of 768 GB, which means that neither an M nor an L processor is required - A configuration using 12x 128GB DIMMs per processor is a total of 1.5 TB, which means that an M processor is required - A configuration using 6x 32GB DIMMs + 6x 256GB DCPMMs is a total of 1.69 TB which means an M processor is required (an L processor may also be used) - A configuration using 6x 128GB DIMMs + 6x 512GB DCPMMs is a total of 3.75 TB which means an L processor is required The following table lists the features of the supported second-generation Intel Xeon processors.

 

Specification:

 

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	3.6 GHz
Cooler included	No
Thermal Design Power (TDP)	150 W
Processor cache	25 MB
Processor model	6244
Processor threads	16
Processor operating modes	64-bit
Processor boost frequency	4.4 GHz
Stepping	B1
Bus type	UPI
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	8
Box	No
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1000 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	150 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	150 W
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
AVX-512 Fused Multiply-Add (FMA) units	2
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	150 W
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Embedded options available	No
Market segment	Server
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® vPro™ Platform Eligibility	Yes
Operational conditions
Tcase	74 °C