BX80673I99900X - Intel INTEL CORE I99900X 3.5 GHZ

Intel Core i9-9900X. Processor family: Intel® Core™ i9 X-series, Processor socket: LGA 2066 (Socket R4), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Desktop, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0, AVX-512, Scalability: 1S. Intel® Turbo Boost Max Technology 3.0 frequency: 4.5 GHz. Package width: 1.73" (44 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm)

 

Specification:

 

Processor
Processor base frequency	3.1 GHz
Processor manufacturer	Intel
Cooler included	Yes
Processor codename	Skylake
Thermal Design Power (TDP)	255 W
Processor cache	38.5 MB
Processor ARK ID	189452
Processor model	W-3175X
Processor threads	56
System bus rate	8 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.8 GHz
Bus type	DMI3
Component for	PC
Processor lithography	14 nm
Processor family	Intel® Xeon®
Processor cores	28
Box	Yes
Processor socket	FCLGA3647
Processor cache type	Smart Cache
Memory
Maximum internal memory supported by processor	512 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2666 MHz
Supported memory types	DDR4-SDRAM
Memory channels	Hexa-channel
ECC	Yes
Graphics
On-board graphics card	No
Power
Thermal Design Power (TDP)	255 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.2, AVX, AVX 2.0, AVX-512
Scalability	1S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
CPU configuration (max)	1
Product type	Processor
Processor cache	39424 KB
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	255 W
Supported memory types	DDR4-SDRAM
Status	Launched
Market segment	Desktop
Launch date	Q4'18
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	Smart Cache
Bus type units	GT/s
Bus bandwidth	8
Maximum memory	512 GB
Intel TSX-NI version	1.00
Processor brand name	Intel Xeon
Last change	63903513
Product family	Intel Xeon Processors
Intel® Speed Shift Technology version	1.00
Memory speed (max)	2666 MHz
Intel® Volume Management Device (VMD) version	1.00
AVX-512 Fused Multiply-Add (FMA) units	2
Bus speed	8 GT/s
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	255 W
Processor package size	76mm x 56.5mm
Processor ARK ID	189452
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.2, AVX, AVX 2.0, AVX-512
Scalability	1S
Embedded options available	No
CPU configuration (max)	1
Market segment	Desktop
Harmonized System (HS) code	85423119
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	G077159
PCI Express CEM revision	3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel® Optane™ Memory Ready	No
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel TSX-NI version	1.00
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® Boot Guard	Yes
Intel® Volume Management Device (VMD)	Yes
Intel® vPro™ Platform Eligibility	Yes
Intel® Transactional Synchronization Extensions	Yes
Operational conditions
Tjunction	85 °C
Tcase	70 °C
Packaging data
Package width	4.09" (104 mm)
Package depth	5.12" (130 mm)
Package height	1.77" (45 mm)
Package weight	11.4 oz (322 g)
Package type	Retail box
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Processor package size	76mm x 56.5mm
Package width	4.09" (104 mm)
Package depth	5.12" (130 mm)
Package height	1.77" (45 mm)
Package weight	11.4 oz (322 g)
Other features
Maximum internal memory	512 GB
Maximum internal memory	524288 MB
CPU configuration (max)	1