BX8069510940X - Intel BOXED INTEL CORE I9-10940X PROCESSOR (19.25M CACHE, 3.30 GHZ) FC-LGA14A

Intel Core i9-10940X. Processor family: Intel® Core™ i9 X-series, Processor socket: LGA 2066 (Socket R4), Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 256 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Desktop, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0, AVX-512, Scalability: 1S. Intel® Turbo Boost Max Technology 3.0 frequency: 4.8 GHz. Package type: Retail box

 

Specification:

 

Processor
Processor generation	10th gen Intel® Core™ i9
Processor base frequency	3 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Memory bandwidth supported by processor (max)	94 GB/s
Thermal Design Power (TDP)	165 W
Processor cache	24.75 MB
Processor ARK ID	198017
Processor model	i9-10980XE
Processor threads	36
System bus rate	8 GT/s
Processor operating modes	64-bit
Processor boost frequency	4.6 GHz
Component for	PC
Processor lithography	14 nm
Processor family	Intel® Core™ i9 X-series Extreme Edition
Processor cores	18
Box	Yes
Processor socket	LGA 2066 (Socket R4)
Processor cache type	Smart Cache
Generation	10th Generation
Memory
Maximum internal memory supported by processor	256 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory bandwidth supported by processor (max)	94 GB/s
Supported memory types	DDR4-SDRAM
Memory channels	Quad-channel
ECC	No
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	165 W
Technical details
Thermal solution specification	PCG 2017X
Intel® Turbo Boost Technology	2.0
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0, AVX-512
Scalability	1S
Embedded options available	No
CPU configuration (max)	1
Product type	Processor
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	165 W
Supported memory types	DDR4-SDRAM
Status	Launched
Market segment	Desktop
Launch date	Q4'19
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	Smart Cache
Maximum memory	256 GB
AVX-512 Fused Multiply-Add (FMA) units	2
Bus speed	8 GT/s DMI3
Target market	Gaming
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	165 W
Processor ARK ID	198017
Thermal solution specification	PCG 2017X
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0, AVX-512
Scalability	1S
Embedded options available	No
CPU configuration (max)	1
Market segment	Desktop
Harmonized System (HS) code	85423119
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	G077159
PCI Express CEM revision	3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	Yes
Intel® Optane™ Memory Ready	Yes
Intel® Turbo Boost Technology	2.0
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® Deep Learning Boost (Intel® DL Boost)	Yes
Intel® Turbo Boost Max Technology 3.0 frequency	4.8 GHz
Operational conditions
Tjunction	86 °C
Packaging data
Package width	5.43" (138 mm)
Package depth	5.43" (138 mm)
Package height	2.4" (61 mm)
Package weight	17.3 oz (490 g)
Package type	Retail box
Weight & dimensions
Package width	5.43" (138 mm)
Package depth	5.43" (138 mm)
Package height	2.4" (61 mm)
Package weight	17.3 oz (490 g)
Other features
Maximum internal memory	256 GB
CPU configuration (max)	1