CD8069504201101 - Intel SVRWS XP CASCADE LAKE-SP 8260

Intel Xeon 8260. Processor family: Intel® Xeon® Platinum, Processor socket: FCLGA3647, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: S8S. Processor package size: 76mm x 56.5mm. Maximum internal memory: 1000 GB

 

Specification:

 

Processor
Processor base frequency	2.4 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	165 W
Processor cache	35.75 MB
Processor ARK ID	192477
Processor model	8260M
Processor threads	48
Processor operating modes	64-bit
Processor boost frequency	3.9 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Platinum
Processor cores	24
Box	No
Processor socket	LGA 3647 (Socket P)
Memory
Maximum internal memory supported by processor	2048 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	165 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	S8S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Product type	Processor
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	165 W
Status	Launched
Market segment	Server
Launch date	Q2'19
Intel Virtualization Technology (VT-x)	Yes
Number of UPI links	3
Memory speed (max)	2933 MHz
AVX-512 Fused Multiply-Add (FMA) units	2
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	165 W
Processor package size	76.0 x 56.5 mm
Processor ARK ID	192477
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX-512
Scalability	S8S
Embedded options available	No
Market segment	Server
Harmonized System (HS) code	85423119
PCI Express CEM revision	3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® Volume Management Device (VMD)	Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)	No
Intel® Optane™ DC Persistent Memory Supported	Yes
Intel® Deep Learning Boost (Intel® DL Boost)	Yes
Mode-based Execute Control (MBE)	Yes
Intel® Run Sure Technology	Yes
Intel® Resource Director Technology (Intel® RDT)	Yes
Intel® vPro™ Platform Eligibility	Yes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF)	No
Intel® Optane™ DC Persistent Memory technology	Yes
Intel Speed Select Technology (SST)	No
Operational conditions
Tcase	90 °C
Weight & dimensions
Processor package size	76.0 x 56.5 mm