CD8069504214302 - Intel SVRWS XP CASCADE LAKE-SP 5217

Intel Xeon 5217. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA3647, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 4S. Processor package size: 76mm x 56.5mm. Maximum internal memory: 1000 GB

 

Specification:

 

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.2 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	125 W
Processor cache	24.75 MB
Processor ARK ID	193388
Processor model	5220
Processor threads	36
Processor operating modes	64-bit
Processor boost frequency	3.9 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	18
Box	No
Processor socket	FCLGA3647
Memory
Maximum internal memory supported by processor	1024 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2667 MHz
Supported memory types	DDR4-SDRAM
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	125 W
Technical details
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.2, AVX, AVX 2.0, AVX-512
Scalability	4S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Product type	Processor
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	125 W
Supported memory types	DDR4-SDRAM
Status	Launched
Market segment	Server
Launch date	Q2'19
Intel Virtualization Technology (VT-x)	Yes
Number of UPI links	2
Memory speed (max)	2667 MHz
AVX-512 Fused Multiply-Add (FMA) units	1
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	125 W
Processor package size	76mm x 56.5mm
Processor ARK ID	193388
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.2, AVX, AVX 2.0, AVX-512
Scalability	4S
Embedded options available	No
Market segment	Server
Harmonized System (HS) code	85423119
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	G077159
PCI Express CEM revision	3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Speed Shift Technology	Yes
Intel TSX-NI	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	1
Intel® Volume Management Device (VMD)	Yes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)	No
Intel® Optane™ DC Persistent Memory Supported	Yes
Intel® Deep Learning Boost (Intel® DL Boost)	Yes
Mode-based Execute Control (MBE)	Yes
Intel® Run Sure Technology	Yes
Intel® Resource Director Technology (Intel® RDT)	Yes
Intel® vPro™ Platform Eligibility	Yes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF)	No
Intel® Optane™ DC Persistent Memory technology	Yes
Intel Speed Select Technology (SST)	No
Intel® Transactional Synchronization Extensions	Yes
Operational conditions
Tcase	87 °C
Packaging data
Package width	1.69" (43 mm)
Package depth	5.39" (137 mm)
Package height	4.41" (112 mm)
Package weight	7.09 oz (201 g)
Package type	Retail box
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Processor package size	76mm x 56.5mm
Package width	1.69" (43 mm)
Package depth	5.39" (137 mm)
Package height	4.41" (112 mm)
Package weight	7.09 oz (201 g)
Other features
Maximum internal memory	1000 GB