CM8070104291317 - Intel I3-10100 UP TO 4.30GHZ 6M, TRAY

Intel Core i3-10100. Processor family: Intel® Core™ i3, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel® UHD Graphics 630, Maximum on-board graphics card memory: 64 GB, On-board graphics card base frequency: 350 MHz. Market segment: Desktop, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 4.3 GHz

 

Specification:

 

Processor
Processor generation	10th gen Intel® Core™ i3
Processor base frequency	3.6 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Comet Lake
Memory bandwidth supported by processor (max)	41.6 GB/s
Thermal Design Power (TDP)	65 W
Processor cache	6 MB
Processor ARK ID	203473
Processor model	i3-10100F
Processor threads	8
System bus rate	8 GT/s
Processor operating modes	64-bit
Processor boost frequency	4.3 GHz
Component for	PC
Processor lithography	14 nm
Processor family	Intel® Core™ i3
Processor cores	4
Box	No
Processor socket	LGA 1200 (Socket H5)
Processor cache type	Smart Cache
Memory
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2666 MHz
Memory bandwidth supported by processor (max)	41.6 GB/s
Supported memory types	DDR4-SDRAM
Memory channels	Dual-channel
ECC	No
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	65 W
Technical details
Intel Stable Image Platform Program (SIPP)	No
Thermal solution specification	PCG 2015C
Intel® Secure Key	Yes
Thermal Monitoring Technologies	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	No
Intel® Identity Protection Technology (Intel® IPT)	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Idle States	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
PCI Express configurations	1x16, 2x8, 1x8+2x4
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Scalability	1S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
CPU configuration (max)	1
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	65 W
Supported memory types	DDR4-SDRAM
Status	Launched
Market segment	Desktop
Launch date	Q4'20
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	Smart Cache
Features
Maximum number of PCI Express lanes	16
Thermal Design Power (TDP)	65 W
Processor package size	37.5 x 37.5 mm
Processor ARK ID	203473
Thermal solution specification	PCG 2015C
Thermal Monitoring Technologies	Yes
Idle States	Yes
Execute Disable Bit	Yes
PCI Express slots version	3.0
PCI Express configurations	1x16, 2x8, 1x8+2x4
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Scalability	1S
Embedded options available	No
CPU configuration (max)	1
Market segment	Desktop
Harmonized System (HS) code	85423119
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	G077159
Processor special features
Intel Software Guard Extensions (Intel SGX)	Yes
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	No
Intel® Optane™ Memory Ready	Yes
Intel® OS Guard	Yes
Intel Stable Image Platform Program (SIPP)	No
Intel® Secure Key	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	No
Intel® Identity Protection Technology (Intel® IPT)	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® Boot Guard	Yes
Intel® Thermal Velocity Boost	No
Intel® vPro™ Platform Eligibility	No
Intel® Turbo Boost Technology 2.0 frequency	4.3 GHz
Intel® Transactional Synchronization Extensions	No
Operational conditions
Tjunction	100 °C
Packaging data
Package type	Retail box
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Processor package size	37.5 x 37.5 mm
Other features
Maximum internal memory	128 GB
CPU configuration (max)	1