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- Processors
- LF80537GE0251MN - Intel INTEL PENTIUM T2330 1.6G
Description
Intel Pentium T2330. Processor family: Intel Pentium Mobile, Processor socket: Socket 478, Processor lithography: 65 nm. Market segment: Mobile, Number of Processing Die Transistors: 291 M, Processing Die size: 143 mm². Processor package size: 35mm x 35mm. Cache memory: 1 MB
Specification:
| Processor | |
|---|---|
| Processor base frequency | 1.6 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Merom |
| Thermal Design Power (TDP) | 34 W |
| Processor cache | 2 MB |
| Processor ARK ID | 27252 |
| Processor model | T5200 |
| Processor threads | 2 |
| Processor operating modes | 64-bit |
| VID Voltage Range | 1.075 - 1.175 V |
| FSB Parity | No |
| Bus type | FSB |
| Component for | Notebook |
| Processor lithography | 65 nm |
| Processor family | Intel® Core™2 Duo |
| Processor front side bus | 533 MHz |
| Processor cores | 2 |
| Processor cache type | L2 |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 34 W |
| VID Voltage Range | 1.075 - 1.175 V |
| Technical details | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 34 W |
| Market segment | Mobile |
| Intel Virtualization Technology (VT-x) | No |
| Processor cache type | L2 |
| Features | |
| Thermal Design Power (TDP) | 34 W |
| Processor package size | 35 x 35 mm |
| Processor ARK ID | 27252 |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 291 M |
| Processing Die size | 143 mm² |
| Embedded options available | No |
| Market segment | Mobile |
| Processor special features | |
| Intel 64 | Yes |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | No |
| Operational conditions | |
| Tjunction | 85 °C |
| Weight & dimensions | |
| Processor package size | 35 x 35 mm |
Shipping & Return
Shipping Information
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