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- 7XG7A05588 - Lenovo SR650 XEON 6128 6C/115W/3.4GHZ
Description
With two processors installed, the two processors are connected together using one UPI link. With four processors installed, the processors are connected together using a ring topology, using two UPI links, one to each adjacent processor in the ring. Processors with the T suffix have more robust thermal characteristics (higher T-case). Processors with the M suffix support support greater than 768 GB per processor.
Specification:
| Processor | |
|---|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.6 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 19.25 MB |
| Processor model | 6126T |
| Processor threads | 24 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Stepping | H0 |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 12 |
| Processor socket | LGA 3647 (Socket P) |
| Processor series | Intel Xeon Gold 6000 Series |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 125 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX,AVX 2.0,AVX-512,SSE4.2 |
| Scalability | S4S |
| Embedded options available | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Processor series | Intel Xeon Gold 6000 Series |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 125 W |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX,AVX 2.0,AVX-512,SSE4.2 |
| Scalability | S4S |
| Embedded options available | Yes |
| Market segment | Server |
| Processor special features | |
| Intel 64 | Yes |
| Conflict-Free processor | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 89 °C |
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