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- 7XG7A06229 - Lenovo SD530 XEON 6130 16C/125W/2.1GHZ
Description
| Processor | |
|---|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 22 MB |
| Processor model | 6130 |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 16 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 125 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Embedded options available | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 125 W |
| Processor package size | 76 x 56.5 mm |
| PCI Express slots version | 3.0 |
| Scalability | S4S |
| Embedded options available | Yes |
| Market segment | Server |
| Processor special features | |
| Intel 64 | Yes |
| Conflict-Free processor | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 87 °C |
| Weight & dimensions | |
| Processor package size | 76 x 56.5 mm |
| Other features | |
| Compatibility | Lenovo ThinkSystem SD530 |
Specification:
| Processor | |
|---|---|
| Processor generation | 1st Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.7 GHz |
| Cooler included | No |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 165 W |
| Processor cache | 24.75 MB |
| Processor model | 6150 |
| Processor threads | 36 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Stepping | H0 |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Processor socket | LGA 3647 (Socket P) |
| Processor series | Intel Xeon Gold 6000 Series |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 165 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX,AVX 2.0,SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 165 W |
| Processor series | Intel Xeon Gold 6000 Series |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 165 W |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX,AVX 2.0,SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel 64 | Yes |
| Conflict-Free processor | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 89 °C |
Shipping & Return
Shipping Information
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Delivery Time: 1-2 business days for order handling, with an additional 3-5 business days for transit within the USA.
-
Shipping Cost: We offer USA Flat Rate $10 Shipping with tracking number for Upto 10LBS items.
-
Tracking: You will receive a tracking number via email to monitor your order’s progress.
-
Support: For any shipping queries or issues, contact us at info@aeonfly.com or call +1 (302) 499-4044.
For full shipping details, please visit our complete shipping policy.
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