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Description
Intel Xeon 6250. Processor family: Intel® Xeon® Gold, Processor socket: FCLGA3647, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: S4S. Processor package size: 76mm x 56.5mm. Maximum internal memory: 1000 GB
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Specification:
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| Processor | |
|---|---|
| Processor base frequency | 3.8 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Memory bandwidth supported by processor (max) | 93.85 GB/s |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 8.25 MB |
| Processor ARK ID | 198608 |
| Processor model | W-2235 |
| Processor threads | 12 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon W |
| Processor cores | 6 |
| Box | No |
| Processor socket | LGA 2066 (Socket R4) |
| Memory | |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory bandwidth supported by processor (max) | 93.85 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Quad-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 130 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x4, 1x8, 1x16 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Physical Address Extension (PAE) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 130 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Physical Address Extension (PAE) | 46 bit |
| Market segment | Workstation |
| Launch date | Q4'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Bus speed | 8 GT/s |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 130 W |
| Processor package size | 45mm x 52.5mm |
| Processor ARK ID | 198608 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1x4, 1x8, 1x16 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Physical Address Extension (PAE) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Physical Address Extension (PAE) | 46 bit |
| Market segment | Workstation |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Memory Protection Extensions (Intel® MPX) | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel® OS Guard | Yes |
| Intel TSX-NI | Yes |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 64 °C |
| Packaging data | |
| Package width | 1.73" (44 mm) |
| Package depth | 4.57" (116 mm) |
| Package height | 3.98" (101 mm) |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 45mm x 52.5mm |
| Package width | 1.73" (44 mm) |
| Package depth | 4.57" (116 mm) |
| Package height | 3.98" (101 mm) |
| Other features | |
| Maximum internal memory | 1000 GB |
| CPU configuration (max) | 1 |
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