CD8070604481002 - Intel XEON PLATINUM 8354H PROCESSOR

Intel Xeon ® ® Platinum 8354H Processor (24.75M Cache, 3.10 GHz). Processor family: Intel® Xeon® Platinum, Processor socket: FCLGA4189, Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1146.88 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: S8S. Processor package size: 77.5 x 56.5 mm. Maximum internal memory: 1120 GB

 

Specification:

 

Processor
Processor generation	3rd Generation Intel® Xeon® Scalable
Processor base frequency	2.3 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cooper Lake
Thermal Design Power (TDP)	165 W
Processor cache	33 MB
Processor ARK ID	204095
Processor model	6348H
Processor threads	48
Processor operating modes	64-bit
Processor boost frequency	4.2 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® Gold
Processor cores	24
Box	No
Processor socket	FCLGA4189
Memory
Maximum internal memory supported by processor	1146.88 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	165 W
Technical details
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.2, AVX, AVX 2.0, AVX-512
Scalability	4S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Product type	Processor
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	165 W
Status	Launched
Market segment	Server
Launch date	Q2'20
Intel Virtualization Technology (VT-x)	Yes
Number of UPI links	6
Memory speed (max)	2933 MHz
AVX-512 Fused Multiply-Add (FMA) units	2
Target market	Cloud Computing
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	165 W
Processor package size	77.5mm x 56.5mm
Processor ARK ID	204095
Execute Disable Bit	Yes
PCI Express slots version	3.0
Supported instruction sets	SSE4.2, AVX, AVX 2.0, AVX-512
Scalability	4S
Embedded options available	No
Market segment	Server
Harmonized System (HS) code	85423119
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	G077159
PCI Express CEM revision	3.0
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel® Speed Shift Technology	Yes
Intel® Optane™ Memory Ready	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® Volume Management Device (VMD)	Yes
Intel® Optane™ DC Persistent Memory Supported	Yes
Intel® Deep Learning Boost (Intel® DL Boost)	Yes
Mode-based Execute Control (MBE)	Yes
Intel® Run Sure Technology	Yes
Intel® Resource Director Technology (Intel® RDT)	Yes
Intel® Optane™ DC Persistent Memory technology	Yes
Intel® Transactional Synchronization Extensions	Yes
Logistics data
Harmonized System (HS) code	85423119
Weight & dimensions
Processor package size	77.5mm x 56.5mm
Other features
Maximum internal memory	1120 GB