CM8070104282624 - Intel I9-10900 UP TO 5.20GHZ 20M, TRAY

Intel Core i9-10900. Processor family: Intel® Core™ i9, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. On-board graphics card model: Intel® UHD Graphics 630, Maximum on-board graphics card memory: 64 GB, On-board graphics card base frequency: 350 MHz. Market segment: Desktop, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.1 GHz, Intel® Turbo Boost Technology 2.0 frequency: 5 GHz, Intel® Thermal Velocity Boost Temperature: 70 °C

 

Specification:

 

Processor
Processor generation	10th gen Intel® Core™ i9
Processor base frequency	2.8 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Comet Lake
Memory bandwidth supported by processor (max)	45.8 GB/s
Thermal Design Power (TDP)	65 W
Processor cache	20 MB
Processor ARK ID	199329
Processor model	i9-10900F
Processor threads	20
System bus rate	8 GT/s
Processor operating modes	64-bit
Processor boost frequency	5.2 GHz
Component for	PC
Processor lithography	14 nm
Processor family	Intel® Core™ i9
Processor cores	10
Box	No
Processor socket	LGA 1200 (Socket H5)
Processor cache type	Smart Cache
Generation	10th Generation
Memory
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory bandwidth supported by processor (max)	45.8 GB/s
Supported memory types	DDR4-SDRAM
Memory channels	Dual-channel
ECC	No
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	65 W
Technical details
Intel Stable Image Platform Program (SIPP)	No
Thermal solution specification	PCG 2015C
Intel® Secure Key	Yes
Thermal Monitoring Technologies	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	No
Intel® Identity Protection Technology (Intel® IPT)	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Idle States	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	3.0
PCI Express configurations	1x16, 2x8, 1x8+2x4
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Scalability	1S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
CPU configuration (max)	1
Product type	Processor
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	65 W
Supported memory types	DDR4-SDRAM
Status	Launched
Market segment	Desktop
Launch date	Q2'20
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	Smart Cache
Maximum memory	128 GB
Bus speed	8 GT/s
Target market	Gaming, Content Creation
Features
Maximum number of PCI Express lanes	16
Thermal Design Power (TDP)	65 W
Processor package size	37.5 x 37.5 mm
Processor ARK ID	199329
Thermal solution specification	PCG 2015C
Thermal Monitoring Technologies	Yes
Idle States	Yes
Execute Disable Bit	Yes
PCI Express slots version	3.0
PCI Express configurations	1x16, 2x8, 1x8+2x4
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Scalability	1S
Embedded options available	No
CPU configuration (max)	1
Market segment	Desktop
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	G077159
PCI Express CEM revision	3.0
Processor special features
Intel Software Guard Extensions (Intel SGX)	Yes
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel Turbo Boost Max Technology 3.0	Yes
Intel® Optane™ Memory Ready	Yes
Intel® OS Guard	Yes
Intel Stable Image Platform Program (SIPP)	No
Intel® Secure Key	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	No
Intel® Identity Protection Technology (Intel® IPT)	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® Boot Guard	Yes
Intel® Thermal Velocity Boost	Yes
Intel® vPro™ Platform Eligibility	No
Intel® Turbo Boost Technology 2.0 frequency	5 GHz
Intel® Turbo Boost Max Technology 3.0 frequency	5.1 GHz
Intel® Transactional Synchronization Extensions	No
Intel® Thermal Velocity Boost Temperature	70 °C
Intel® Thermal Velocity Boost Frequency	5.2 GHz
Operational conditions
Tjunction	100 °C
Packaging data
Package width	1.73" (44 mm)
Package depth	4.57" (116 mm)
Package height	3.98" (101 mm)
Package type	Retail box
Logistics data
Harmonized System (HS) code	8542310001
Weight & dimensions
Processor package size	37.5 x 37.5 mm
Package width	1.73" (44 mm)
Package depth	4.57" (116 mm)
Package height	3.98" (101 mm)
Other features
Maximum internal memory	128 GB
CPU configuration (max)	1