CN80617004122AG - Intel CORE I3-330M

Intel Core i3-330M. Processor family: Intel® Core™ i3, Processor socket: BGA 1288, Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 8 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics card model: Intel® HD Graphics, On-board graphics card base frequency: 500 MHz, On-board graphics card dynamic frequency (max): 667 MHz. Market segment: Desktop, PCI Express configurations: 1x16, Number of Processing Die Transistors: 382 M. Processor package size: 37.5mm x 37.5mm; 34mm x 28mm

 

Specification:

 

Processor
Processor base frequency	2.26 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Arrandale
Memory bandwidth supported by processor (max)	17.1 GB/s
Thermal Design Power (TDP)	35 W
Processor cache	3 MB
Processor ARK ID	43529
Processor model	i3-350M
Processor threads	4
System bus rate	2.5 GT/s
Processor operating modes	64-bit
Stepping	C2
CPU multiplier (bus/core ratio)	17
Bus type	DMI
Component for	Notebook
Processor lithography	32 nm
Processor family	3rd gen Intel® Core™ i3
Processor cores	2
Box	No
Processor socket	BGA 1288
Processor code	SLBPL
Processor series	Intel Core i3-300 Mobile Series
Processor cache type	Smart Cache
Generation	3rd Generation
Memory
Maximum internal memory supported by processor	8 GB
Memory types supported by processor	DDR3-SDRAM
Memory clock speeds supported by processor	800,1066 MHz
Memory bandwidth supported by processor (max)	17.1 GB/s
Supported memory types	DDR3-SDRAM
Memory channels	Dual-channel
ECC	No
Graphics
Number of displays supported (on-board graphics)	2
On-board graphics adapter model	Intel® HD Graphics
On-board graphics adapter	Yes
On-board graphics adapter dynamic frequency (max)	667 MHz
On-board graphics adapter base frequency	500 MHz
Power
Thermal Design Power (TDP)	35 W
Technical details
Cache memory	3 MB
Thermal Monitoring Technologies	Yes
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	No
Intel® Smart Cache	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel Flex Memory Access	Yes
Intel FDI Technology	Yes
Intel Fast Memory Access	Yes
Intel Dual Display Capable Technology	Yes
Intel® Clear Video HD Technology (Intel® CVT HD)	Yes
Intel® AES New Instructions (Intel® AES-NI)	No
Idle States	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel® Virtualization Technology (Intel® VT)	VT-x
PCI Express slots version	2.0
PCI Express configurations	1x16
Number of Processing Die Transistors	382 M
Processing Die size	81 mm²
Number of Graphics & IMC Die Transistors	177 M
Graphics & IMC Die Size	114 mm²
Supported instruction sets	SSE4.1,SSE4.2
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Enhanced Halt State	Yes
Graphics & IMC lithography	45 nm
Embedded options available	No
CPU configuration (max)	1
Bandwidth	2.5 MB/s
Processor code	SLBPL
Product type	Processor
Processor cache	3072 KB
Intel Virtualization Technology for Directed I/O (VT-d)	No
Intel 64	Yes
Thermal Design Power (TDP)	35 W
Supported memory types	DDR3-SDRAM
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)	Yes
Status	Discontinued
Product name	Intel Core i3-350M (3M Cache, 2.26 GHz)
Processor series	Intel Core i3-300 Mobile Series
Physical Address Extension (PAE)	36 bit
Market segment	Mobile
Launch date	Q1'10
Intel Virtualization Technology (VT-x)	Yes
Graphics max dynamic frequency	667 MHz
Processor cache type	Smart Cache
Bus type units	GT/s
Bus bandwidth	2.5
Born on date	Q1'10
Maximum memory	8 GB
Processor brand name	Intel Core i3
Last change	63903513
Product family	Previous Generation Intel Core i3 Processor
Bus speed	2.5 GT/s
Features
Maximum number of PCI Express lanes	16
Thermal Design Power (TDP)	35 W
Processor package size	37.5mm x 37.5mm; 34mm x 28mm
Processor ARK ID	43529
Thermal Monitoring Technologies	Yes
Idle States	Yes
Execute Disable Bit	Yes
PCI Express slots version	2.0
PCI Express configurations	1x16
Number of Processing Die Transistors	382 M
Processing Die size	81 mm²
Number of Graphics & IMC Die Transistors	177 M
Graphics & IMC Die Size	114 mm²
Supported instruction sets	SSE4.1,SSE4.2
Graphics & IMC lithography	45 nm
Embedded options available	No
CPU configuration (max)	1
Bandwidth	2.5 MB/s
Processor code	SLBPL
Physical Address Extension (PAE)	36 bit
Market segment	Mobile
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	3A991
Commodity Classification Automated Tracking System (CCATS)	NA
PCI Express CEM revision	2.0
Processor special features
Macrovision License Required	No
Intel Clear Video Technology	Yes
Intel Virtualization Technology for Directed I/O (VT-d)	No
Intel 64	Yes
Intel® Turbo Boost Technology	No
Intel Trusted Execution Technology	No
Intel® Smart Cache	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel Flex Memory Access	Yes
Intel FDI Technology	Yes
Intel Fast Memory Access	Yes
Intel Dual Display Capable Technology	Yes
Intel® Clear Video HD Technology (Intel® CVT HD)	Yes
Intel® AES New Instructions (Intel® AES-NI)	No
Enhanced Intel SpeedStep Technology	Yes
Intel® Virtualization Technology (Intel® VT)	VT-x
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Enhanced Halt State	Yes
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® vPro™ Platform Eligibility	No
Operational conditions
Tjunction	105 °C
Weight & dimensions
Processor package size	37.5mm x 37.5mm; 34mm x 28mm
Other features
Cache memory	3 MB
Intel® Virtualization Technology (Intel® VT)	VT-x
Maximum internal memory	8 GB
Maximum internal memory	8192 MB
CPU configuration (max)	1
Processor code	SLBPL