Skip to product information
1 of 1

Intel

CP80617004161AC - Intel KIT CORE I3-350M

CP80617004161AC - Intel KIT CORE I3-350M

SKU:CP80617004161AC

Regular price $160.10 USD
Regular price Sale price $160.10 USD
Sale Sold out
Shipping calculated at checkout.
Intel Core i3-350M. Processor family: Intel® Core™ i3, Processor socket: BGA 1288, Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 8 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics adapter model: Intel® HD Graphics, On-board graphics adapter base frequency: 500 MHz, On-board graphics adapter dynamic frequency (max): 667 MHz. Market segment: Mobile, PCI Express configurations: 1x16, Number of Processing Die Transistors: 382 M. Processor package size: 37.5mm x 37.5mm; 34mm x 28mm

 

Specification:

 

Processor
Processor generation Intel® Core™ i5
Processor base frequency 2.26 GHz
Processor manufacturer Intel
Cooler included No
Processor codename Arrandale
Memory bandwidth supported by processor (max) 17.1 GB/s
Thermal Design Power (TDP) 35 W
Processor cache 3 MB
Processor ARK ID 43537
Processor model i5-430M
Processor threads 4
System bus rate 2.5 GT/s
Processor operating modes 64-bit
Processor boost frequency 2.53 GHz
CPU multiplier (bus/core ratio) 17
Bus type DMI
Processor lithography 32 nm
Processor family Intel® Core™ i5
Processor cores 2
Box No
Processor socket BGA 1288
Processor code SLBPN
Processor series Intel Core i5-400 Series
Processor cache type Smart Cache
Generation 4th Generation
Memory
Maximum internal memory supported by processor 8 GB
Memory types supported by processor DDR3-SDRAM
Memory bandwidth supported by processor (max) 17.1 GB/s
Supported memory types DDR3-SDRAM
Memory channels Dual-channel
ECC No
Graphics
Number of displays supported (on-board graphics) 2
On-board graphics card model Intel® HD Graphics
On-board graphics card Yes
On-board graphics card dynamic frequency (max) 766 MHz
On-board graphics card base frequency 500 MHz
Power
Thermal Design Power (TDP) 35 W
Technical details
Thermal Monitoring Technologies Yes
Intel® Turbo Boost Technology 1.0
Intel Trusted Execution Technology No
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel Flex Memory Access Yes
Intel FDI Technology Yes
Intel Fast Memory Access Yes
Intel Dual Display Capable Technology Yes
Intel® Clear Video HD Technology (Intel® CVT HD) Yes
Intel® AES New Instructions (Intel® AES-NI) No
Idle States Yes
Execute Disable Bit Yes
Enhanced Intel SpeedStep Technology Yes
PCI Express slots version 2.0
PCI Express configurations 1x16
Number of Processing Die Transistors 382 M
Processing Die size 81 mm²
Number of Graphics & IMC Die Transistors 177 M
Graphics & IMC Die Size 114 mm²
Supported instruction sets SSE4.1, SSE4.2
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Enhanced Halt State Yes
Graphics & IMC lithography 45 nm
Embedded options available No
CPU configuration (max) 1
Processor code SLBPN
Product type Processor
Processor cache 3072 KB
Intel Virtualization Technology for Directed I/O (VT-d) No
Intel 64 Yes
Thermal Design Power (TDP) 35 W
Supported memory types DDR3-SDRAM
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) Yes
Status Discontinued
Processor series Intel Core i5-400 Series
Physical Address Extension (PAE) 36 bit
Market segment Mobile
Launch date Q1'10
Intel Virtualization Technology (VT-x) Yes
Processor cache type Smart Cache
Bus type units GT/s
Bus bandwidth 2.5
Maximum memory 8 GB
Processor brand name Intel Core i5
Last change 63903513
Product family Previous Generation Intel Core i5 Processor
Bus speed 2.5 GT/s
Features
Maximum number of PCI Express lanes 16
Thermal Design Power (TDP) 35 W
Processor package size 37.5mm x 37.5mm; 34mm x 28mm
Processor ARK ID 43537
Thermal Monitoring Technologies Yes
Idle States Yes
Execute Disable Bit Yes
PCI Express slots version 2.0
PCI Express configurations 1x16
Number of Processing Die Transistors 382 M
Processing Die size 81 mm²
Number of Graphics & IMC Die Transistors 177 M
Graphics & IMC Die Size 114 mm²
Supported instruction sets SSE4.1, SSE4.2
Graphics & IMC lithography 45 nm
Embedded options available No
CPU configuration (max) 1
Processor code SLBPN
Physical Address Extension (PAE) 36 bit
Market segment Mobile
Harmonized System (HS) code 8542310001
Export Control Classification Number (ECCN) 3A991
Commodity Classification Automated Tracking System (CCATS) NA
PCI Express CEM revision 2.0
Processor special features
Macrovision License Required No
Intel Clear Video Technology Yes
Intel Virtualization Technology for Directed I/O (VT-d) No
Intel 64 Yes
Conflict-Free processor No
Intel® Turbo Boost Technology 1.0
Intel Trusted Execution Technology No
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel Flex Memory Access Yes
Intel FDI Technology Yes
Intel Fast Memory Access Yes
Intel Dual Display Capable Technology Yes
Intel® Clear Video HD Technology (Intel® CVT HD) Yes
Intel® AES New Instructions (Intel® AES-NI) No
Enhanced Intel SpeedStep Technology Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Enhanced Halt State Yes
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) Yes
Intel Virtualization Technology (VT-x) Yes
Intel® vPro™ Platform Eligibility No
Operational conditions
Tjunction 105 °C
Weight & dimensions
Processor package size 37.5mm x 37.5mm; 34mm x 28mm
Other features
Maximum internal memory 8 GB
Maximum internal memory 8192 MB
CPU configuration (max) 1
Processor code SLBPN
View full details

Customer Reviews

Be the first to write a review
0%
(0)
0%
(0)
0%
(0)
0%
(0)
0%
(0)