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Intel

Intel INTEL SVR SYST D50TNP1MHCPAC

Intel INTEL SVR SYST D50TNP1MHCPAC

SKU:D50TNP1MHCPAC

Regular price $1,765.69 USD
Regular price Sale price $1,765.69 USD
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Intel Server System D50TNP1MHCPAC Compute Module. Motherboard chipset: Intel C621A, Processor manufacturer: Intel. Supported memory types: DDR4-SDRAM, Maximum internal memory: 6000 GB, Memory bandwidth (max): 204.8 GB/s. Supported storage drive interfaces: PCI Express, Serial ATA, RAID levels: 0, 1. On-board graphics card model: Aspeed AST2500. Ethernet interface type: 10 Gigabit Ethernet

 

Specification:

 

Hard drive
RAID levels 0, 1
Processor
Built-in processor No
Number of processors supported 2
Motherboard chipset Intel C621A
Processor manufacturer Intel
Memory
Supported memory types DDR4-SDRAM
Number of DIMM slots 16
Maximum internal memory 2000 GB
ECC Yes
Memory bandwidth (max) 204.8 GB/s
Memory channels Hexadeca-channel
Storage
Number of storage drives supported 2
Supported storage drive interfaces PCI Express, Serial ATA
RAID levels 0, 1
Performance
Intel Advanced Management Technology Yes
Trusted Platform Module (TPM) version 2.0
Trusted Platform Module (TPM) Yes
Intel Intelligent Power Node Manager Yes
Integrated BMC with IPMI Yes
Graphics
On-board graphics card model Aspeed AST2500
Network
Ethernet LAN Yes
Ethernet interface type 10 Gigabit Ethernet
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 3
USB ports quantity 3
VGA (D-Sub) ports quantity 1
Serial ports quantity 1
Number of SATA connectors 2
Ethernet LAN (RJ-45) ports 1
USB version 3.2 Gen 1 (3.1 Gen 1)
Expansion slots
PCI Express x16 slots 2
PCI Express slots version 4.0
PCI Express OCuLink connectors (NVMe support) 8
Features
Trusted Platform Module (TPM) version 2.0
Trusted Platform Module (TPM) Yes
Integrated BMC with IPMI Yes
Harmonized System (HS) code 8473301180
Export Control Classification Number (ECCN) 5A002U
Commodity Classification Automated Tracking System (CCATS) G157815L1
Embedded options available No
Number of UPI links 3
Intel Node Manager Yes
Technical details
USB ports quantity 3
Packaging content (1) Intel® Server Board DDR4 D50TNP1SBCR (1) 1U half-width module tray – iPN K53210 (1) 1U compute module air duct – iPN K61940 (2) 1U PCIe Riser (x16 PCIe slot and M.2 Connector) for D50TNP1SBCR board TNP1UCRRISER (2) 1U riser bracket to support TNP1UCRRISER – iPN K25206 (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor carrier clip, for 3rd Gen Intel® Xeon® Scalable processor family iPN J98484 (2) M.2 heat sink assembly TNPM2HS
Number of storage drives supported 2
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel Advanced Management Technology Yes
Trusted Platform Module (TPM) version 2.0
Trusted Platform Module (TPM) Yes
Rack-Friendly board Yes
Intel Intelligent Power Node Manager Yes
Integrated BMC with IPMI Yes
CPU configuration (max) 2
Chassis type Rack (1U)
Target market High Performance Computing
Status Launched
Riser slot 2 number of lanes 16
Riser slot 1 number of lanes 16
Launch date Q2'21
Extended warranty available for purchase (select countries) Yes
Expected discontinuance date 2025
Harmonized System (HS) code 8473301180
Export Control Classification Number (ECCN) 5A002U
Commodity Classification Automated Tracking System (CCATS) G157815L1
Logistics data
Harmonized System (HS) code 8473301180
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel Advanced Management Technology Yes
Intel Intelligent Power Node Manager Yes
Intel® Optane™ Memory Ready Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Processor ARK ID 210523
Design
Rack-Friendly board Yes
Chassis type Rack (1U)
Power
Thermal Design Power (TDP) 205 W
Packaging data
Packaging content (1) Intel® Server Board DDR4 D50TNP1SBCR (1) 1U half-width module tray – iPN K53210 (1) 1U compute module air duct – iPN K61940 (2) 1U PCIe Riser (x16 PCIe slot and M.2 Connector) for D50TNP1SBCR board TNP1UCRRISER (2) 1U riser bracket to support TNP1UCRRISER – iPN K25206 (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor carrier clip, for 3rd Gen Intel® Xeon® Scalable processor family iPN J98484 (2) M.2 heat sink assembly TNPM2HS
Other features
On-board graphics card No
CPU configuration (max) 2
Target market High Performance Computing
Status Launched
Riser slot 2 number of lanes 16
Riser slot 1 number of lanes 16
Launch date Q2'21
Extended warranty available for purchase (select countries) Yes
Expected discontinuance date 2025
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