ET-YO324BBEGUS - Samsung GEAR VR CONTROLLER, STANDARD
ET-YO324BBEGUS - Samsung GEAR VR CONTROLLER, STANDARD
SKU:ET-YO324BBEGUS
Regular price
$36.05 USD
Regular price
Sale price
$36.05 USD
Unit price
per
Make your world bigger Samsung Gear VR¹ transforms virtual reality with a new handheld controller that seamlessly responds to organic, human movements in virtual experiences.² Every move, from turning and grabbing to pointing and lifting, is naturally connected from physical to virtual, making it more intuitive and spellbinding than ever before. Flying through the Alps, watching a film with a far-off friend, experiencing a festival across the globe, and employing the superpowers of your game’s character – your world just got infinitely bigger.
Specification:
Processor | |
---|---|
Processor base frequency | 2.53 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Wolfdale |
Thermal Design Power (TDP) | 65 W |
Processor cache | 3 MB |
Processor ARK ID | 35348 |
Processor model | E7200 |
Processor threads | 2 |
Processor operating modes | 64-bit |
VID Voltage Range | 0.85 - 1.3625 V |
FSB Parity | No |
CPU multiplier (bus/core ratio) | 9.5 |
Bus type | FSB |
Processor lithography | 45 nm |
Processor front side bus | 1066 MHz |
Processor cores | 2 |
Box | No |
Processor socket | LGA 775 (Socket T) |
Processor series | Intel Core 2 Duo E7000 Series |
Processor cache type | L2 |
Power | |
Thermal Design Power (TDP) | 65 W |
VID Voltage Range | 0.85 - 1.3625 V |
Technical details | |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Intel® AES New Instructions (Intel® AES-NI) | No |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Number of Processing Die Transistors | 228 M |
Processing Die size | 82 mm² |
Intel Enhanced Halt State | Yes |
Intel Demand Based Switching | No |
Embedded options available | No |
Product type | Processor |
Processor cache | 3072 KB |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Status | Discontinued |
Processor series | Intel Core 2 Duo E7000 Series |
Market segment | Desktop |
Launch date | Q2'08 |
Intel Virtualization Technology (VT-x) | No |
Processor cache type | L2 |
Bus type units | MHz |
Bus bandwidth | 1066 |
Processor brand name | Intel Core2 Duo |
Last change | 63903513 |
Product family | Legacy Intel Core2 Processor |
Bus speed | 1066 MHz |
Features | |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 35348 |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Number of Processing Die Transistors | 228 M |
Processing Die size | 82 mm² |
Embedded options available | No |
Market segment | Desktop |
Harmonized System (HS) code | 8542310001 |
Export Control Classification Number (ECCN) | 3A991.A.1 |
Commodity Classification Automated Tracking System (CCATS) | NA |
Processor special features | |
Intel 64 | Yes |
Conflict-Free processor | No |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | No |
Intel® AES New Instructions (Intel® AES-NI) | No |
Enhanced Intel SpeedStep Technology | Yes |
Intel Enhanced Halt State | Yes |
Intel Demand Based Switching | No |
Intel Virtualization Technology (VT-x) | No |
Operational conditions | |
Tcase | 74.1 °C |
Packaging data | |
Package type | Retail box |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |