GG8068204237001 - Intel XEON PROCESSOR D-1627

Intel Xeon D-1627. Processor family: Intel® Xeon® D, Processor socket: FCBGA1667, Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR3-SDRAM. Market segment: Server, PCI Express slots version: 2.0, 3.0, Supported instruction sets: AVX 2.0. USB version: 2.0/3.2 Gen 1 (3.1 Gen 1). Intel® Turbo Boost Technology 2.0 frequency: 3.2 GHz

 

Specification:

 

Processor
Processor base frequency	2.9 GHz
Processor manufacturer	Intel
Cooler included	No
Thermal Design Power (TDP)	55 W
Processor cache	9 MB
Processor ARK ID	193693
Processor model	D-1637
Processor threads	12
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel® Xeon® D
Processor cores	6
Box	No
Processor socket	FCBGA1667
Memory
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM, DDR3-SDRAM
Memory clock speeds supported by processor	2400 MHz
Supported memory types	DDR4-SDRAM, DDR3-SDRAM
Memory channels	Dual-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	55 W
Technical details
Intel TSX-NI	Yes
Intel® Secure Key	Yes
Thermal Monitoring Technologies	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Idle States	Yes
Execute Disable Bit	Yes
Enhanced Intel SpeedStep Technology	Yes
PCI Express slots version	2.0, 3.0
Supported instruction sets	AVX 2.0
Scalability	1S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
CPU configuration (max)	1
Product type	System on Chip
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	55 W
Supported memory types	DDR4-SDRAM, DDR3-SDRAM
Number of SATA III connectors	6
Status	Launched
Market segment	Server
Launch date	Q2'19
Intel Virtualization Technology (VT-x)	Yes
Maximum memory	128 GB
Memory speed (max)	2400 MHz
Features
Maximum number of PCI Express lanes	32
Thermal Design Power (TDP)	55 W
Processor package size	37.5 x 37.5 mm
Processor ARK ID	193693
Thermal Monitoring Technologies	Yes
Idle States	Yes
Execute Disable Bit	Yes
PCI Express slots version	2.0, 3.0
Supported instruction sets	AVX 2.0
Scalability	1S
Embedded options available	No
CPU configuration (max)	1
Market segment	Server
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	5A002R
Commodity Classification Automated Tracking System (CCATS)	G168319
I/O configuration
USB version	2.0/3.2 Gen 1 (3.1 Gen 1)
USB ports quantity	8
Integrated LAN	No
Total number of SATA connectors	6
Number of SATA III connectors	6
General Purpose IO	Yes
Processor special features
Intel Software Guard Extensions (Intel SGX)	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel ME Firmware Version	3
General Purpose IO	Yes
Intel QuickAssist Technology	No
Intel® Optane™ Memory Ready	No
Intel Quiet System Technology (QST)	No
Intel® OS Guard	Yes
Intel TSX-NI	Yes
Intel® Secure Key	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel® Boot Guard	No
Intel® Turbo Boost Technology 2.0 frequency	3.2 GHz
Intel® Transactional Synchronization Extensions	Yes
Operational conditions
Tjunction	105 °C
Tcase	77 °C
Logistics data
Harmonized System (HS) code	8542310001
Weight & dimensions
Processor package size	37.5 x 37.5 mm
Other features
Maximum internal memory	128 GB
CPU configuration (max)	1