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Lenovo 4XG0Q17168 computer cooling system Processor Air cooler Black, Metallic

4XG0Q17168 - Lenovo THINKSTATION PX20 205W HEAT SINK

Name: 4XG0Q17168 - Lenovo THINKSTATION PX20 205W HEAT SINK
Brand: Lenovo
SKU: 4XG0Q17168
Price: 49.68 USD
Availability: InStock
Rating: 3.7 (1 reviews)

Condition:

$49.68

Availability: In Stock Unavailable

SKU: 4XG0Q17168

Brand: Lenovo

Categories:

All Collections, Computer Components, Computer Cooling Systems

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ThinkStation Px20 205W Heat Sink supports ThinkStation Px20 systems, fully qualified to provide you quite, reliable cooling for Xeon CPUs under full operating loads. This Heat sink comes with great flexibility, it is the great choice for ThinkStation customers.

Specification:

Processor
Processor generation	1st Generation IntelÂ® XeonÂ® Scalable
Processor base frequency	2.3 GHz
Cooler included	Yes
Thermal Design Power (TDP)	105 W
Processor cache	16.5 MB
Processor model	5118
Processor threads	24
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	IntelÂ® XeonÂ® Gold
Processor cores	12
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	768 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
On-board graphics card	No
Power
Thermal Design Power (TDP)	105 W
Technical details
Intel TSX-NI	Yes
IntelÂ® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
IntelÂ® Hyper Threading Technology (IntelÂ® HT Technology)	Yes
IntelÂ® AES New Instructions (IntelÂ® AES-NI)	Yes
PCI Express slots version	3.0
Supported instruction sets	AVX 2.0,AVX-512,SSE4.2
Embedded options available	Yes
Intel 64	Yes
Thermal Design Power (TDP)	105 W
Market segment	Server
Intel Virtualization Technology (VT-x)	Yes
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	105 W
Processor package size	76 x 56.5 mm
PCI Express slots version	3.0
Supported instruction sets	AVX 2.0,AVX-512,SSE4.2
Embedded options available	Yes
Market segment	Server
Processor special features
Intel 64	Yes
Conflict-Free processor	Yes
Intel Turbo Boost Max Technology 3.0	No
IntelÂ® Speed Shift Technology	Yes
IntelÂ® Optaneâ„¢ Memory Ready	No
Intel TSX-NI	Yes
IntelÂ® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
IntelÂ® Hyper Threading Technology (IntelÂ® HT Technology)	Yes
IntelÂ® AES New Instructions (IntelÂ® AES-NI)	Yes
Intel Virtualization Technology (VT-x)	Yes
IntelÂ® vProâ„¢ Platform Eligibility	Yes
Operational conditions
Tcase	81 Â°C
Weight & dimensions
Processor package size	76 x 56.5 mm

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