4XG7A72930 - Lenovo ST650 V2 SILVER 4309Y 8C 105W 2.8GHZ

Lenovo Xeon Intel Silver 4309Y. Processor family: Intel Xeon Silver, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6144 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 8 GB. Package type: Retail box

 

Specification:

 

Processor
Processor generation	3rd Generation Intel® Xeon® Scalable
Processor base frequency	3.1 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Ice Lake
Thermal Design Power (TDP)	205 W
Processor cache	36 MB
Processor ARK ID	212457
Processor model	6346
Processor threads	32
System bus rate	11.2 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.6 GHz
Component for	Server/workstation
Processor lithography	10 nm
Processor family	Intel® Xeon®
Processor cores	16
Box	No
Processor socket	FCLGA4189
Memory
Maximum internal memory supported by processor	6144 GB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Supported memory types	DDR4-SDRAM
Memory channels	Octa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	205 W
Technical details
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Execute Disable Bit	Yes
PCI Express slots version	4.0
Supported instruction sets	SSE4.2,AVX,AVX 2.0,AVX-512
Scalability	2S
Intel VT-x with Extended Page Tables (EPT)	Yes
Embedded options available	No
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Thermal Design Power (TDP)	205 W
Supported memory types	DDR4-SDRAM
Status	Launched
Market segment	Server
Launch date	Q2'21
Intel Virtualization Technology (VT-x)	Yes
Number of UPI links	3
Memory speed (max)	3200 MHz
AVX-512 Fused Multiply-Add (FMA) units	2
Features
Maximum number of PCI Express lanes	64
Thermal Design Power (TDP)	205 W
Processor package size	77.5 x 56.5 mm
Processor ARK ID	212457
Execute Disable Bit	Yes
PCI Express slots version	4.0
Supported instruction sets	SSE4.2,AVX,AVX 2.0,AVX-512
Scalability	2S
Embedded options available	No
Market segment	Server
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	5A992CN3
Commodity Classification Automated Tracking System (CCATS)	G178966
Processor special features
Intel Software Guard Extensions (Intel SGX)	Yes
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel 64	Yes
Intel® Speed Shift Technology	Yes
Intel® Optane™ Memory Ready	Yes
Intel® Turbo Boost Technology	2.0
Intel Trusted Execution Technology	Yes
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel Virtualization Technology (VT-x)	Yes
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® Volume Management Device (VMD)	Yes
Intel® Optane™ DC Persistent Memory Supported	Yes
Intel® Deep Learning Boost (Intel® DL Boost)	Yes
Mode-based Execute Control (MBE)	Yes
Intel® Run Sure Technology	Yes
Intel® Resource Director Technology (Intel® RDT)	Yes
Intel® Transactional Synchronization Extensions	Yes
Intel® Total Memory Encryption	Yes
Maximum Enclave Size Support for Intel® SGX	64 GB
Intel® Platform Firmware Resilience Support	Yes
Intel® Crypto Acceleration	Yes
Operational conditions
Tcase	78 °C
Weight & dimensions
Processor package size	77.5 x 56.5 mm
Other features
Maximum internal memory	6000 GB