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- Computer Components
- AW80576SH0616M - Intel INTEL CORE2 DUO P9500
Description
Intel Core P9500. Processor family: Intel® Core™2 Duo, Processor socket: Socket 478, Processor lithography: 45 nm. Market segment: Mobile, Number of Processing Die Transistors: 410 M, Processing Die size: 107 mm². Package type: Retail box. Processor package size: 35mm x 35mm
Â
Specification:
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| Processor | |
|---|---|
| Processor base frequency | 2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Penryn |
| Thermal Design Power (TDP) | 25 W |
| Processor cache | 3 MB |
| Processor ARK ID | 36750 |
| Processor model | P7350 |
| Processor threads | 2 |
| Processor operating modes | 64-bit |
| VID Voltage Range | 1.062 - 1.15 V |
| FSB Parity | No |
| Bus type | FSB |
| Processor lithography | 45 nm |
| Processor front side bus | 1066 MHz |
| Processor cores | 2 |
| Box | No |
| Processor socket | Socket 478 |
| Processor series | Intel Core 2 Duo P7000 Series |
| Processor cache type | L2 |
| Power | |
| Thermal Design Power (TDP) | 25 W |
| VID Voltage Range | 1.062 - 1.15 V |
| Technical details | |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Number of Processing Die Transistors | 410 M |
| Processing Die size | 107 mm² |
| Intel Demand Based Switching | No |
| Embedded options available | No |
| Product type | Processor |
| Processor cache | 3072 KB |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 25 W |
| Status | Discontinued |
| Processor series | Intel Core 2 Duo P7000 Series |
| Market segment | Mobile |
| Launch date | Q3'08 |
| Intel Virtualization Technology (VT-x) | No |
| Processor cache type | L2 |
| Bus type units | MHz |
| Bus bandwidth | 1066 |
| Processor brand name | Intel Core2 Duo |
| Last change | 63903513 |
| Product family | Legacy Intel Core2 Processor |
| Bus speed | 1066 MHz |
| Features | |
| Thermal Design Power (TDP) | 25 W |
| Processor package size | 35mm x 35mm |
| Processor ARK ID | 36750 |
| Execute Disable Bit | Yes |
| Number of Processing Die Transistors | 410 M |
| Processing Die size | 107 mm² |
| Embedded options available | No |
| Market segment | Mobile |
| Harmonized System (HS) code | 8542310001 |
| Export Control Classification Number (ECCN) | 3A991.A.1 |
| Commodity Classification Automated Tracking System (CCATS) | NA |
| Processor special features | |
| Intel 64 | Yes |
| Conflict-Free processor | No |
| Intel® Turbo Boost Technology | No |
| Intel Trusted Execution Technology | No |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Demand Based Switching | No |
| Intel Virtualization Technology (VT-x) | No |
| Weight & dimensions | |
| Processor package size | 35mm x 35mm |
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